Skip to content
Search Classifications
Search for IPC and CPC classification codes or keywords
CPC Subgroup Additional Only
H05K 2201/10886

Other details

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Details of components or other objects attached to or integrated in a printed circuit board > Details of electrical connections of non-printed components, e.g. special leads > Details of leads > Other details

8 direct subcodes

Child Classifications

Navigate with arrow keys, Enter to open

  • H05K 2201/10893 Grouped leads, i.e. element comprising multiple leads distributed around but not through a common insulator
  • H05K 2201/10901 Lead partly inserted in hole or via
  • H05K 2201/10909 Materials of terminal, e.g. of leads or electrodes of components
  • H05K 2201/10916 Terminals having auxiliary metallic piece, e.g. for soldering
  • H05K 2201/10924 Leads formed from a punched metal foil
  • H05K 2201/10931 Exposed leads, i.e. encapsulation of component partly removed for exposing a part of lead, e.g. for soldering purposes
  • H05K 2201/10939 Lead of component used as a connector
  • H05K 2201/10946 Leads attached onto leadless component after manufacturing the component

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907