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CPC Subgroup Additional Only
H05K 2201/10954

Other details of electrical connections

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Details of components or other objects attached to or integrated in a printed circuit board > Details of electrical connections of non-printed components, e.g. special leads > Other details of electrical connections

5 direct subcodes

Child Classifications

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  • H05K 2201/10962 Component not directly connected to the PCB
  • H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB
  • H05K 2201/10977 Encapsulated connections
  • H05K 2201/10984 Component carrying a connection agent, e.g. solder, adhesive
  • H05K 2201/10992 Using different connection materials, e.g. different solders, for the same connection

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907