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PCE
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CPC Subgroup Additional Only
H05K 2201/2063

mixed adhesion layer containing metallic/inorganic and polymeric materials

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Details of printed circuits not provided for in H05K2201/01 - H05K2201/10 > mixed adhesion layer containing metallic/inorganic and polymeric materials