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CPC Subgroup Additional Only
H05K 2201/20

Details of printed circuits not provided for in H05K2201/01 - H05K2201/10

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Details of printed circuits not provided for in H05K2201/01 - H05K2201/10

10 direct subcodes

Child Classifications

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  • H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
  • H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
  • H05K 2201/2027 Guiding means, e.g. for guiding flexible circuits
  • H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly
  • H05K 2201/2045 Protection against vibrations
  • H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
  • H05K 2201/2063 mixed adhesion layer containing metallic/inorganic and polymeric materials
  • H05K 2201/2072 Anchoring, i.e. one structure gripping into another
  • H05K 2201/2081 Compound repelling a metal, e.g. solder
  • H05K 2201/209 Auto-mechanical connection between a component and a PCB or between two PCBs

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907