CPC Subgroup Additional Only
H05K 2201/20 Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
Full Title
Indexing scheme relating to printed circuits covered by H05K1/00 > Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
10 direct subcodes
Child Classifications
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- H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
- H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
- H05K 2201/2027 Guiding means, e.g. for guiding flexible circuits
- H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly
- H05K 2201/2045 Protection against vibrations
- H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
- H05K 2201/2063 mixed adhesion layer containing metallic/inorganic and polymeric materials
- H05K 2201/2072 Anchoring, i.e. one structure gripping into another
- H05K 2201/2081 Compound repelling a metal, e.g. solder
- H05K 2201/209 Auto-mechanical connection between a component and a PCB or between two PCBs
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907