CPC Subgroup Additional Only
H05K 2203/0104 for patterning or coating
Full Title
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Tools for processing; Objects used during processing > for patterning or coating
9 direct subcodes
Child Classifications
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- H05K 2203/0108 Male die used for patterning, punching or transferring
- H05K 2203/0113 Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
- H05K 2203/0117 Pattern shaped electrode used for patterning, e.g. plating or etching
- H05K 2203/0121 Patterning, e.g. plating or etching by moving electrode
- H05K 2203/0126 Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
- H05K 2203/013 Inkjet printing, e.g. for printing insulating material or resist
- H05K 2203/0134 Drum, e.g. rotary drum or dispenser with a plurality of openings
- H05K 2203/0139 Blade or squeegee, e.g. for screen printing or filling of holes
- H05K 2203/0143 Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907