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CPC Subgroup Additional Only
H05K 2203/01

Tools for processing; Objects used during processing

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Tools for processing; Objects used during processing

7 direct subcodes

Child Classifications

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  • H05K 2203/0178 Projectile, e.g. for perforating substrate
  • H05K 2203/0182 Using a temporary spacer element or stand-off during processing
  • H05K 2203/0186 Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
  • H05K 2203/0191 Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
  • H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907