CPC Subgroup Additional Only
H05K 2203/01 Tools for processing; Objects used during processing
Full Title
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Tools for processing; Objects used during processing
7 direct subcodes
Child Classifications
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- H05K 2203/0104 for patterning or coating
- H05K 2203/0147 Carriers and holders
- H05K 2203/0178 Projectile, e.g. for perforating substrate
- H05K 2203/0182 Using a temporary spacer element or stand-off during processing
- H05K 2203/0186 Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
- H05K 2203/0191 Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
- H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907