CPC Subgroup Additional Only
H05K 2203/0242 Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
Full Title
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound > Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH