Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound

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Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound

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• H05K 2203/0207 Partly drilling through substrate until a controlled depth, e.g. with end-point detection
• H05K 2203/0214 Back-up or entry material, e.g. for mechanical drilling
• H05K 2203/0221 Perforating
• H05K 2203/0228 Cutting, sawing, milling or shearing
• H05K 2203/0235 Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
• H05K 2203/0242 Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
• H05K 2203/025 Abrading, e.g. grinding or sand blasting
• H05K 2203/0257 Brushing, e.g. cleaning the conductive pattern by brushing or wiping
• H05K 2203/0264 Peeling insulating layer, e.g. foil, or separating mask
• H05K 2203/0271 Mechanical force other than pressure, e.g. shearing or pulling
• H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• H05K 2203/0285 Using ultrasound, e.g. for cleaning, soldering or wet treatment
• H05K 2203/0292 Using vibration, e.g. during soldering or screen printing