Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering

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Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Soldering or other types of metallurgic bonding > Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering