Soldering or other types of metallurgic bonding

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Soldering or other types of metallurgic bonding

Child Classifications

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• H05K 2203/0405 Solder foil, tape or wire
• H05K 2203/041 Solder preforms in the shape of solder balls
• H05K 2203/0415 Small preforms other than balls, e.g. discs, cylinders or pillars
• H05K 2203/042 Remote solder depot on the PCB, the solder flowing to the connections from this depot
• H05K 2203/0425 Solder powder or solder coated metal powder
• H05K 2203/043 Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
• H05K 2203/0435 Metal coated solder, e.g. for passivation of solder balls
• H05K 2203/044 Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
• H05K 2203/0445 Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking
• H05K 2203/045 Solder-filled plated through-hole [PTH] during processing wherein the solder is removed from the PTH after processing
• H05K 2203/0455 PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
• H05K 2203/046 Means for drawing solder, e.g. for removing excess solder from pads
• H05K 2203/0465 Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
• H05K 2203/047 Soldering with different solders, e.g. two different solders on two sides of the PCB
• H05K 2203/0475 Molten solder just before placing the component
• H05K 2203/048 Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
• H05K 2203/0485 Tacky flux, e.g. for adhering components during mounting
• H05K 2203/049 Wire bonding
• H05K 2203/0495 Cold welding