Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls

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Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Treatments involving liquids, e.g. plating, rinsing > Plating > Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls