Plating

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Treatments involving liquids, e.g. plating, rinsing > Plating

Child Classifications

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• H05K 2203/0706 Inactivating or removing catalyst, e.g. on surface of resist
• H05K 2203/0709 Catalytic ink or adhesive for electroless plating
• H05K 2203/0713 Plating poison, e.g. for selective plating or for preventing plating on resist
• H05K 2203/0716 Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
• H05K 2203/072 Electroless plating, e.g. finish plating or initial plating
• H05K 2203/0723 Electroplating, e.g. finish plating
• H05K 2203/0726 Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
• H05K 2203/073 Displacement plating, substitution plating or immersion plating, e.g. for finish plating
• H05K 2203/0733 Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls