Plating

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Treatments involving liquids, e.g. plating, rinsing > Plating

Filing statistics

CPC H05K 2203/0703 belongs to the parent subclass H05K, which recorded 393,752 patent applications worldwide between 2013 and 2023. Annual filings grew from 26,893 in 2013 to 40,478 in 2023 (+51%), peaking at 44,441 applications in 2021. The most active applicants in class H05 are SAMSUNG ELECTRONICS COMPANY (9,981 applications), SAMSUNG DISPLAY (5,041 applications) and LG ELECTRONICS (4,742 applications).

Source: EPO PATSTAT, worldwide filings

9 direct subcodes

Child Classifications

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H05K 2203/0706 Inactivating or removing catalyst, e.g. on surface of resist
H05K 2203/0709 Catalytic ink or adhesive for electroless plating
H05K 2203/0713 Plating poison, e.g. for selective plating or for preventing plating on resist
H05K 2203/0716 Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
H05K 2203/072 Electroless plating, e.g. finish plating or initial plating
H05K 2203/0723 Electroplating, e.g. finish plating
H05K 2203/0726 Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
H05K 2203/073 Displacement plating, substitution plating or immersion plating, e.g. for finish plating
H05K 2203/0733 Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 9,981
SAMSUNG DISPLAY KR 5,041
LG ELECTRONICS KR 4,742
PHILIP MORRIS PRODUCTS CH 4,411
PANASONIC INTELLECTUAL PROPERTY JP 3,915
PANASONIC INTELLECTUAL PROPERTY 3,471
SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
MURATA MANUFACTURING COMPANY JP 3,191
FUJI JP 2,987
SIGNIFY HOLDING NL 2,907