Uses of liquids, e.g. rinsing, coating, dissolving

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Treatments involving liquids, e.g. plating, rinsing > Uses of liquids, e.g. rinsing, coating, dissolving

Child Classifications

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• H05K 2203/0759 Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
• H05K 2203/0763 Treating individual holes or single row of holes, e.g. by nozzle
• H05K 2203/0766 Rinsing, e.g. after cleaning or polishing a conductive pattern
• H05K 2203/0769 Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
• H05K 2203/0773 Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
• H05K 2203/0776 Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773