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CPC Subgroup Additional Only
H05K 2203/0736

Methods for applying liquids, e.g. spraying

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Treatments involving liquids, e.g. plating, rinsing > Methods for applying liquids, e.g. spraying

5 direct subcodes

Child Classifications

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  • H05K 2203/074 Features related to the fluid pressure
  • H05K 2203/0743 Mechanical agitation of fluid, e.g. during cleaning of the conductive pattern
  • H05K 2203/0746 Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
  • H05K 2203/075 Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
  • H05K 2203/0753 Reversing fluid direction, e.g. in holes

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907