CPC Subgroup Additional Only
H05K 2203/1333 Deposition techniques, e.g. coating
Full Title
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Moulding and encapsulation; Deposition techniques; Protective layers > Deposition techniques, e.g. coating
7 direct subcodes
Child Classifications
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- H05K 2203/1338 Chemical vapour deposition
- H05K 2203/1344 Spraying small metal particles or droplets of molten metal
- H05K 2203/135 Electrophoretic deposition of insulating material
- H05K 2203/1355 Powder coating of insulating material
- H05K 2203/1361 Coating by immersion in coating bath
- H05K 2203/1366 Spraying coating
- H05K 2203/1372 Coating by using a liquid wave
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907