CPC Subgroup Additional Only
H05K 2203/1581 Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
Full Title
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Position of the PCB during processing > Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside