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CPC Subgroup Additional Only
H05K 2203/15

Position of the PCB during processing

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Position of the PCB during processing

10 direct subcodes

Child Classifications

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  • H05K 2203/1509 Horizontally held PCB
  • H05K 2203/1518 Vertically held PCB
  • H05K 2203/1527 Obliquely held PCB
  • H05K 2203/1536 Temporarily stacked PCBs
  • H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
  • H05K 2203/1554 Rotating or turning the PCB in a continuous manner
  • H05K 2203/1563 Reversing the PCB
  • H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
  • H05K 2203/1581 Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
  • H05K 2203/159 Using gravitational force; Processing against the gravity direction; Using centrifugal force

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907