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CPC Subgroup Additional Only
H05K 2203/17

Post-manufacturing processes

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Post-manufacturing processes

5 direct subcodes

Child Classifications

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  • H05K 2203/171 Tuning, e.g. by trimming of printed components or high frequency circuits
  • H05K 2203/173 Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
  • H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
  • H05K 2203/176 Removing, replacing or disconnecting component; Easily removable component
  • H05K 2203/178 Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907