CPC Subgroup Additional Only
H05K 2203/17 Post-manufacturing processes
Full Title
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Post-manufacturing processes
5 direct subcodes
Child Classifications
Navigate with arrow keys, Enter to open
- H05K 2203/171 Tuning, e.g. by trimming of printed components or high frequency circuits
- H05K 2203/173 Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
- H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
- H05K 2203/176 Removing, replacing or disconnecting component; Easily removable component
- H05K 2203/178 Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907