Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17

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• H05K 2203/302 Bending a rigid substrate; Breaking rigid substrates by bending
• H05K 2203/304 Protecting a component during manufacturing
• H05K 2203/306 Lifting the component during or after mounting; Increasing the gap between component and PCB
• H05K 2203/308 Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs