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CPC Subgroup Additional Only
H05K 2203/30

Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17

4 direct subcodes

Child Classifications

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  • H05K 2203/302 Bending a rigid substrate; Breaking rigid substrates by bending
  • H05K 2203/304 Protecting a component during manufacturing
  • H05K 2203/306 Lifting the component during or after mounting; Increasing the gap between component and PCB
  • H05K 2203/308 Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907