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CPC Subgroup Additional Only
H05K 2203/306

Lifting the component during or after mounting; Increasing the gap between component and PCB

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17 > Lifting the component during or after mounting; Increasing the gap between component and PCB