Application of solder

Full Title

Apparatus or processes for manufacturing printed circuits > Assembling printed circuits with electric components, e.g. with resistors > electrically connecting electric components or wires to printed circuits > by soldering > Application of solder

Child Classifications

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• H05K 3/3468 Application of molten solder, e.g. dip soldering
• H05K 3/3473 Plating of solder
• H05K 3/3478 Application of solder preforms; Transferring prefabricated solder patterns
• H05K 3/3485 Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12)