CPC Subgroup
H05K 3/34 by soldering
Full Title
Apparatus or processes for manufacturing printed circuits > Assembling printed circuits with electric components, e.g. with resistors > electrically connecting electric components or wires to printed circuits > by soldering
8 direct subcodes
Child Classifications
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- H05K 3/341 Surface mounted components
- H05K 3/3447 Lead-in-hole components
- H05K 3/3452 Solder masks
- H05K 3/346 Solder materials or compositions specially adapted therefor
- H05K 3/3465 Application of solder
- H05K 3/3489 Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
- H05K 3/3494 Heating processes for reflow soldering
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907