CPC Subgroup
H05K 3/34 by soldering
Full Title
Apparatus or processes for manufacturing printed circuits > Assembling printed circuits with electric components, e.g. with resistors > electrically connecting electric components or wires to printed circuits > by soldering
8 direct subcodes
Child Classifications
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- H05K 3/341 Surface mounted components
- H05K 3/3447 Lead-in-hole components
- H05K 3/3452 Solder masks
- H05K 3/346 Solder materials or compositions specially adapted therefor
- H05K 3/3465 Application of solder
- H05K 3/3489 Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
- H05K 3/3494 Heating processes for reflow soldering