for supporting or gripping

Full Title

Handling or holding of wafers, substrates or devices during manufacture or treatment thereof > for supporting or gripping

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS

Child Classifications

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• H10P 72/72 using electrostatic chucks
• H10P 72/76 using mechanical means, e.g. clamps or pinches
• H10P 72/78 using vacuum or suction, e.g. Bernoulli chucks