for supporting or gripping

Introduced: January 2026

Full Title

Handling or holding of wafers, substrates or devices during manufacture or treatment thereof > for supporting or gripping

Of 4 combined children, 3 exist in both systems.

1 codes are CPC-only extensions.

IPC defines codes here since 2026.

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H10P 72/72 using electrostatic chucks since 2026 +1 CPC IPC+CPC Available in IPC and CPC
H10P 72/74 +16 CPC CPC only CPC only
H10P 72/76 using mechanical means, e.g. clamps or pinches since 2026 +2 CPC IPC+CPC Available in IPC and CPC
H10P 72/78 using vacuum or suction, e.g. Bernoulli chucks since 2026 IPC+CPC Available in IPC and CPC