comprising two or more dielectric layers having different properties, e.g. different dielectric constants

Full Title

Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes > characterised by their insulating parts > comprising two or more dielectric layers having different properties, e.g. different dielectric constants