CPC Subgroup
H10W 20/45 characterised by their insulating parts
Full Title
Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes > characterised by their insulating parts
4 direct subcodes
Child Classifications
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- H10W 20/46 comprising air gaps
- H10W 20/47 comprising two or more dielectric layers having different properties, e.g. different dielectric constants
- H10W 20/48 Insulating materials thereof