CPC Main Group
H10W 40/00 Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60)
9 direct subcodes
Child Classifications
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- H10W 40/10 Arrangements for heating
- H10W 40/20 Arrangements for cooling
- H10W 40/30 wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
- H10W 40/40 involving heat exchange by flowing fluids
- H10W 40/50 Arrangements for sensing temperature
- H10W 40/60 Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W 40/70 Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W 40/80 Circuit arrangements for thermal protection or control of packages