Arrangements for thermal protection or thermal control

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

Related Keywords

Child Classifications

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• H10W 40/1 Arrangements for heating
• H10W 40/2 Arrangements for cooling
• H10W 40/3 wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
• H10W 40/4 involving heat exchange by flowing fluids
• H10W 40/5 Arrangements for sensing temperature
• H10W 40/6 Securing means for detachable heating or cooling arrangements, e.g. clamps
• H10W 40/7 Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
• H10W 40/8 Circuit arrangements for thermal protection or control of packages