IPC Main Group
H10W 40/00 Arrangements for thermal protection or thermal control
Introduced: January 2026
Classification Context
- Section:
- ELECTRICITY
- Class:
- SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Subclass:
- GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS
Scope Notes
Limiting references: Integrated devices comprising arrangements for thermal protection
Related Keywords
VENTILATION of electric solid-state devices
8 direct subcodes
Child Classifications
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- H10W 40/1 Arrangements for heating
- H10W 40/2 Arrangements for cooling
- H10W 40/3 wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
- H10W 40/4 involving heat exchange by flowing fluids
- H10W 40/5 Arrangements for sensing temperature
- H10W 40/6 Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W 40/7 Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W 40/8 Circuit arrangements for thermal protection or control of packages