CPC Subgroup
H10W 70/20 Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40)
Full Title
Package substrates; Interposers; Redistribution layers [RDL] > Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40)
2 direct subcodes
Child Classifications
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