DIFF Subgroup
H10W 70/20 Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40)
Introduced: January 2026
Title
Titles differ between systems:
IPC: Conductive package substrates serving as an interconnection, e.g. metal plates
CPC: Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40)
Full Title
Full titles differ between systems:
IPC:
Package substrates; Interposers; Redistribution layers [RDL] > Conductive package substrates serving as an interconnection, e.g. metal plates
CPC:
Package substrates; Interposers; Redistribution layers [RDL] > Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40)
Of 2 combined children, 0 exist in both systems.
2 codes are CPC-only extensions.
Child Classifications
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