CPC Main Group
H10W 70/00 Package substrates; Interposers; Redistribution layers [RDL]
5 direct subcodes
Child Classifications
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- H10W 70/01 Manufacture or treatment
- H10W 70/20 Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40)
- H10W 70/40 Leadframes
- H10W 70/60 Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)