CPC Subgroup
H10W 70/62 characterised by their interconnections
Full Title
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their interconnections
5 direct subcodes
Child Classifications
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- H10W 70/63 Vias, e.g. via plugs
- H10W 70/65 Shapes or dispositions of interconnections
- H10W 70/66 Conductive materials thereof