characterised by their interconnections

Introduced: January 2026

Full Title

Full titles differ between systems:

IPC:

Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers > characterised by their interconnections

CPC:

Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their interconnections

Of 5 combined children, 3 exist in both systems.

2 codes are CPC-only extensions.

IPC defines codes here since 2026.

Child Classifications

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H10W 70/63 Vias, e.g. via plugs since 2026 +1 CPC IPC+CPC Available in IPC and CPC
H10W 70/641 CPC only CPC only
H10W 70/644 CPC only CPC only
H10W 70/65 Shapes or dispositions of interconnections since 2026 +3 CPC IPC+CPC Available in IPC and CPC
H10W 70/66 Conductive materials thereof since 2026 +4 CPC IPC+CPC Available in IPC and CPC