CPC Subgroup
H10W 70/68 Shapes or dispositions thereof
Full Title
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their insulating layers or insulating parts > Shapes or dispositions thereof
4 direct subcodes
Child Classifications
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- H10W 70/685 comprising multiple insulating layers