DIFF Subgroup
H10W 70/68 Shapes or dispositions thereof
Introduced: January 2026
Full Title
Full titles differ between systems:
IPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers > characterised by their insulating layers or insulating parts > Shapes or dispositions thereof
CPC:
Package substrates; Interposers; Redistribution layers [RDL] > Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) > characterised by their insulating layers or insulating parts > Shapes or dispositions thereof
CPC subdivides this area 4x more granularly than IPC with 3 additional codes.
3 codes are CPC-only extensions.
IPC defines codes here since 2026.
Child Classifications
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- H10W 70/685 comprising multiple insulating layers since 2026 +2 CPC IPC+CPC Available in IPC and CPC