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CPC Subgroup
H10W 76/13

Containers comprising a conductive base serving as an interconnection

Full Title

Containers; Fillings or auxiliary members therefor; Seals > Containers or parts thereof > characterised by their shape > Containers comprising a conductive base serving as an interconnection

4 direct subcodes

Child Classifications

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  • H10W 76/132 having other interconnections through an insulated passage in the conductive base
  • H10W 76/134 having other interconnections parallel to the conductive base
  • H10W 76/136 having other interconnections perpendicular to the conductive base
  • H10W 76/138 having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Top Applicants

Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG DISPLAY KR 38,446
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
  3. SAMSUNG ELECTRONICS COMPANY KR 30,059
  4. BOE TECHNOLOGY GROUP COMPANY CN 20,304
  5. LG DISPLAY COMPANY KR 17,772
  6. BOE TECHNOLOGY GROUP COMPANY 15,621
  7. SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
  8. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
  9. SAMSUNG DISPLAY 11,316
  10. SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697