Containers comprising a conductive base serving as an interconnection

Introduced: January 2026

Full Title

Containers; Fillings or auxiliary members therefor; Seals > Containers or parts thereof > characterised by their shape > Containers comprising a conductive base serving as an interconnection

IPC and CPC are identically structured here. All 4 subcodes exist in both systems.

IPC defines codes here since 2026.

Child Classifications

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H10W 76/132 having other interconnections through an insulated passage in the conductive base since 2026 IPC+CPC Available in IPC and CPC
H10W 76/134 having other interconnections parallel to the conductive base since 2026 IPC+CPC Available in IPC and CPC
H10W 76/136 having other interconnections perpendicular to the conductive base since 2026 IPC+CPC Available in IPC and CPC
H10W 76/138 having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type since 2026 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H10,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG DISPLAY KR 21,044
SAMSUNG ELECTRONICS COMPANY KR 14,774
LG DISPLAY COMPANY KR 9,454
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
BOE TECHNOLOGY GROUP COMPANY 6,845
BOE TECHNOLOGY GROUP COMPANY CN 6,806
SAMSUNG DISPLAY 6,577
LG CHEM KR 5,461
SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115

Top Applicants (CPC)

Class H10,2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG DISPLAY KR 38,446
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
SAMSUNG ELECTRONICS COMPANY KR 30,059
BOE TECHNOLOGY GROUP COMPANY CN 20,304
LG DISPLAY COMPANY KR 17,772
BOE TECHNOLOGY GROUP COMPANY 15,621
SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
SAMSUNG DISPLAY 11,316
SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697