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IPC Subgroup
H10W 76/13

Containers comprising a conductive base serving as an interconnection

Introduced: January 2026

Full Title

Containers; Fillings or auxiliary members therefor; Seals > Containers or parts thereof > characterised by their shape > Containers comprising a conductive base serving as an interconnection

Classification Context

Section:
ELECTRICITY
Class:
SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass:
GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

4 direct subcodes

Child Classifications

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  • H10W 76/132 having other interconnections through an insulated passage in the conductive base
  • H10W 76/134 having other interconnections parallel to the conductive base
  • H10W 76/136 having other interconnections perpendicular to the conductive base
  • H10W 76/138 having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Top Applicants

Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG DISPLAY KR 21,044
  2. SAMSUNG ELECTRONICS COMPANY KR 14,774
  3. LG DISPLAY COMPANY KR 9,454
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
  5. SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
  6. BOE TECHNOLOGY GROUP COMPANY 6,845
  7. BOE TECHNOLOGY GROUP COMPANY CN 6,806
  8. SAMSUNG DISPLAY 6,577
  9. LG CHEM KR 5,461
  10. SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115