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PCE
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DIFF Subgroup
H01R 4/30

utilising a screw or nut clamping member (H01R4/50 takes precedence; utilising a clamping member acted on by screw or nut H01R4/38; )

Introduced: January 1980

Title

Titles differ between systems:

IPC: using a screw or nut clamping member

CPC: utilising a screw or nut clamping member (H01R4/50 takes precedence; utilising a clamping member acted on by screw or nut H01R4/38; )

Full Title

Full titles differ between systems:

IPC:

Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation > Clamped connections; Spring connections > using a screw or nut clamping member

CPC:

Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation > Clamped connections, spring connections (made by means of terminals specially adapted for contact with, or insertion into, printed circuits H01R12/00) > utilising a screw or nut clamping member (H01R4/50 takes precedence; utilising a clamping member acted on by screw or nut H01R4/38; )

CPC subdivides this area 3x more granularly than IPC with 6 additional codes.

6 codes are CPC-only extensions.

IPC defines codes here since 1980.

Child Classifications

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  • H01R 4/301 CPC only CPC only
  • H01R 4/302 CPC only CPC only
  • H01R 4/304 CPC only CPC only
  • H01R 4/305 CPC only CPC only
  • H01R 4/307 CPC only CPC only
  • H01R 4/308 CPC only CPC only
  • H01R 4/32 Conductive members located in slot or hole in screw since 1980 IPC+CPC Available in IPC and CPC
  • H01R 4/34 Conductive members located under head of screw since 1980 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080