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DIFF Subgroup
H01R 4/38

utilising a clamping member acted on by screw or nut (H01R4/50 takes precedence)

Introduced: January 1980

Title

Titles differ between systems:

IPC: using a clamping member acted on by screw or nut

CPC: utilising a clamping member acted on by screw or nut (H01R4/50 takes precedence)

Full Title

Full titles differ between systems:

IPC:

Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation > Clamped connections; Spring connections > using a clamping member acted on by screw or nut

CPC:

Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation > Clamped connections, spring connections (made by means of terminals specially adapted for contact with, or insertion into, printed circuits H01R12/00) > utilising a clamping member acted on by screw or nut (H01R4/50 takes precedence)

IPC and CPC are identically structured here. All 4 subcodes exist in both systems.

IPC defines codes here since 1980.

Child Classifications

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  • H01R 4/40 Pivotable clamping member since 1980 IPC+CPC Available in IPC and CPC
  • H01R 4/42 Clamping area to one side of screw only since 1980 IPC+CPC Available in IPC and CPC
  • H01R 4/44 Clamping areas on both sides of screw since 1980 IPC+CPC Available in IPC and CPC
  • H01R 4/46 Clamping area between two screws placed side by side since 1980 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080