H05K 1/00 Printed circuits
Introduced: September 1968
Additional Content IPC
Record carriers with integrated circuit chips, e.g. chip cards Thin film inductors Waveguides Antennas Connectors Assemblies of multiple devices comprising at least one electronic memory device covered by subclass Assemblies of multiple devices comprising at least one inorganic electric device covered by subclass Integrated inorganic electric semiconductor devices having multiple passive components formed in or on insulating or conducting substrates Assemblies of multiple devices, comprising at least one photovoltaic cell covered by group Assemblies of multiple devices comprising at least one individual radiation-sensitive semiconductor device Assemblies of multiple devices comprising at least one inorganic light-emitting semiconductor device having potential barriers Assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group Assemblies of multiple devices, comprising at least one organic element sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation Assemblies of multiple devices, comprising at least one organic light-emitting element covered by group Assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups Assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups Assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups Assemblies of multiple devices, comprising at least one superconducting element covered by group Assemblies of multiple devices, comprising at least one solid-state element having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching Assemblies of multiple devices, comprising at least one bulk negative resistance effect element covered by group Package substrate or redistribution layers for semiconductor or solid-state devices Package configurations of devices covered by class
IPC and CPC are identically structured here. All 3 subcodes exist in both systems.
1 shared codes have differing titles between IPC and CPC.
Child Classifications
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Top Applicants
Top Applicants (IPC)
Class H05,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 7,201
- PANASONIC INTELLECTUAL PROPERTY 6,828
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
- LG ELECTRONICS KR 3,564
- PANASONIC INTELLECTUAL PROPERTY JP 3,533
- SAMSUNG DISPLAY KR 3,310
- FUJI JP 2,870
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
- MURATA MANUFACTURING COMPANY JP 2,634
Top Applicants (CPC)
Class H05,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907