H05K 1/00 Printed circuits
Introduced: September 1968
Last revised: January 2006
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- Subclass:
- PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
Scope Notes
Application references: Record carriers with integrated circuit chips, e.g. chip cards Thin film inductors Waveguides Antennas Connectors Assemblies of multiple devices comprising at least one electronic memory device covered by subclass Assemblies of multiple devices comprising at least one inorganic electric device covered by subclass Integrated inorganic electric semiconductor devices having multiple passive components formed in or on insulating or conducting substrates Assemblies of multiple devices, comprising at least one photovoltaic cell covered by group Assemblies of multiple devices comprising at least one individual radiation-sensitive semiconductor device Assemblies of multiple devices comprising at least one inorganic light-emitting semiconductor device having potential barriers Assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group Assemblies of multiple devices, comprising at least one organic element sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation Assemblies of multiple devices, comprising at least one organic light-emitting element covered by group Assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups Assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups Assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups Assemblies of multiple devices, comprising at least one superconducting element covered by group Assemblies of multiple devices, comprising at least one solid-state element having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching Assemblies of multiple devices, comprising at least one bulk negative resistance effect element covered by group Package substrate or redistribution layers for semiconductor or solid-state devices Package configurations of devices covered by class
3 direct subcodes
Child Classifications
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