DIFF Subgroup
H05K 1/18 structurally associated with non-printed electric components (H05K1/16 takes precedence)
Introduced: September 1968
Title
Titles differ between systems:
IPC: structurally associated with non-printed electric components
CPC: structurally associated with non-printed electric components (H05K1/16 takes precedence)
Full Title
Full titles differ between systems:
IPC:
Printed circuits > structurally associated with non-printed electric components
CPC:
Printed circuits > structurally associated with non-printed electric components (H05K1/16 takes precedence)
IPC and CPC are identically structured here. All 3 subcodes exist in both systems.
IPC defines codes here since 2026.
Child Classifications
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- H05K 1/182 associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] since 2026 IPC+CPC Available in IPC and CPC
- H05K 1/189 characterised by the use of flexible or folded printed circuits since 2026 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H05,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 7,201
- PANASONIC INTELLECTUAL PROPERTY 6,828
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 3,988
- LG ELECTRONICS KR 3,564
- PANASONIC INTELLECTUAL PROPERTY JP 3,533
- SAMSUNG DISPLAY KR 3,310
- FUJI JP 2,870
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 2,675
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 2,665
- MURATA MANUFACTURING COMPANY JP 2,634
Top Applicants (CPC)
Class H05,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907