DIFF Subgroup
H05K 3/18 using precipitation techniques to apply the conductive material
Introduced: September 1968
Full Title
Apparatus or processes for manufacturing printed circuits > in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern > using precipitation techniques to apply the conductive material
Of 2 combined children, 0 exist in both systems.
2 codes are CPC-only extensions.
Child Classifications
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