Apparatus or processes for manufacturing printed circuits

Introduced: September 1968

CPC subdivides this area 2x more granularly than IPC with 11 additional codes.

11 codes are CPC-only extensions.

1 shared codes have differing titles between IPC and CPC.

Child Classifications

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H05K 3/0002 CPC only CPC only
H05K 3/0005 CPC only CPC only
H05K 3/0008 CPC only CPC only
H05K 3/0011 +4 CPC CPC only CPC only
H05K 3/0058 +3 CPC CPC only CPC only
H05K 3/007 CPC only CPC only
H05K 3/0073 +3 CPC CPC only CPC only
H05K 3/0085 +1 CPC CPC only CPC only
H05K 3/0091 CPC only CPC only
H05K 3/0094 CPC only CPC only
H05K 3/0097 CPC only CPC only
H05K 3/02 in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding +2 CPC IPC+CPC Available in IPC and CPC
H05K 3/10 in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern +6 CPC IPC+CPC Available in IPC and CPC
H05K 3/22 Secondary treatment of printed circuits +3 CPC IPC+CPC Available in IPC and CPC
H05K 3/30 Assembling printed circuits with electric components, e.g. with resistors +1 CPC IPC+CPC Available in IPC and CPC
H05K 3/36 Assembling printed circuits with other printed circuits +3 CPC IPC+CPC Available in IPC and CPC
H05K 3/38 Improvement of the adhesion between the insulating substrate and the metal since 1980 +5 CPC IPC+CPC Available in IPC and CPC
H05K 3/40 Forming printed elements for providing electric connections to or between printed circuits since 1980 +4 CPC IPC+CPC Available in IPC and CPC
H05K 3/44 Manufacturing insulated metal core circuits since 1980 +1 CPC IPC+CPC Available in IPC and CPC
H05K 3/46 Manufacturing multilayer circuits since 1980 +6 CPC IPC+CPC Available in IPC and CPC