DIFF Subgroup
H05K 3/10 in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
Introduced: September 1968
Full Title
Apparatus or processes for manufacturing printed circuits > in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
CPC subdivides this area 3x more granularly than IPC with 6 additional codes.
6 codes are CPC-only extensions.
Child Classifications
Navigate with arrow keys, Enter to open
- H05K 3/12 using printing techniques to apply the conductive material +7 CPC IPC+CPC Available in IPC and CPC
- H05K 3/14 using spraying techniques to apply the conductive material +2 CPC IPC+CPC Available in IPC and CPC
- H05K 3/18 using precipitation techniques to apply the conductive material +2 CPC IPC+CPC Available in IPC and CPC