H05K 3/386 — IPC vs CPC Diff | Patent Classification Explorer

DIFF Subgroup

H05K 3/386

Full Title

Apparatus or processes for manufacturing printed circuits > Improvement of the adhesion between the insulating substrate and the metal

Of 1 combined children, 0 exist in both systems.

1 codes are CPC-only extensions.

This code exists only in CPC.

Diff view requires codes present in both systems.