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PCE
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DIFF Subgroup
H05K 3/38

Improvement of the adhesion between the insulating substrate and the metal

Introduced: January 1980

Full Title

Apparatus or processes for manufacturing printed circuits > Improvement of the adhesion between the insulating substrate and the metal

Of 5 combined children, 0 exist in both systems.

5 codes are CPC-only extensions.

Child Classifications

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