Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers

Introduced: January 2025

Of 8 combined children, 5 exist in both systems.

3 codes are CPC-only extensions.

3 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 2025.

Child Classifications

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H10D 84/01 Manufacture or treatment since 2025 +5 CPC IPC+CPC Available in IPC and CPC
H10D 84/101 +5 CPC CPC only CPC only
H10D 84/201 +1 CPC CPC only CPC only
H10D 84/40 characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs since 2025 +1 CPC IPC+CPC Available in IPC and CPC
H10D 84/60 characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs (H10D84/40 takes precedence) since 2025 +4 CPC IPC+CPC Available in IPC and CPC
H10D 84/80 characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs (H10D84/40 takes precedence) since 2025 +1 CPC IPC+CPC Available in IPC and CPC
H10D 84/891 +1 CPC CPC only CPC only
H10D 84/90 Masterslice integrated circuits since 2025 +4 CPC IPC+CPC Available in IPC and CPC