H10N 30/073 by fusion of metals or by adhesives
Introduced: January 2023
Full Title
Full titles differ between systems:
Piezoelectric or electrostrictive devices > Manufacture or treatment > Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base > by laminating or bonding of piezoelectric or electrostrictive bodies > by fusion of metals or by adhesives
Piezoelectric or electrostrictive devices (integrated devices or assemblies of multiple devices H10N39/00) > Manufacture or treatment > Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base > by laminating or bonding of piezoelectric or electrostrictive bodies > by fusion of metals or by adhesives
No child classifications to compare. This is a leaf node in both IPC and CPC.